Morphological study of ternary Ni–Cu–P alloys by atomic force microscopy

Ternary electroless Ni–Cu–P alloy films were deposited by using nickel sulphate (B1)- and nickel chloride (B2)-based alkaline baths. Alloy films were characterized for their structure, morphology, chemical composition and microhardness. A single broad peak was obtained in XRD for both B1 and B2 films and the calculated grain sizes are 1.6 and 1.9 nm, respectively. Optical microscopic examination of the deposited coatings revealed a less nodular structure for B2-based coatings. SEM micrographs showed that films were smooth and nodular. Compositional analysis made on these deposits using EDX and the chemical state identification by XPS showed that the coatings are almost identical. AFM studies showed that the deposits from B2 bath are comparatively smoother with less nodular structure. Microhardness measurements and potentiodynamic polarization studies in 3.5% NaCl solution showed that both deposits have similar properties.