Detector surface preparation of Cd0.9Zn0.1Te for electrode patterning

One of the challenges in fabricating radiation detectors based on CZT is the surface engineering for electrode deposition. Prior to electrode deposition, it is important the removal of residual contamination from the surface. Using abrasive slurries with micron and sub-micron particulates results in particle adherence to the surface, as can be readily observed using Darkfield microscopy. In addition, the wax bonding of wafers to glass plates for polishing results in further contamination as a result of solvent cleaning and inefficient wax removal in the de-bonding process. In this work, wafer mounting holders which rely upon the surface tension of a liquid are used to replace wax bonding. Using this method, detector surfaces can be prepared without the need for wax bonding and removal. As a result, the pristine nature of the surface is maintained.