A non-aqueous electrodeposition process for fabrication of superhydrophobic surface with hierarchical micro/nano structure

In this work, we present a novel facile electrodeposition approach to create micro/nano structure on an anodic copper plate with an alkali ethanol electrolyte solution. The electrolyte solution is composed of potassium hydroxide, potassium persulfate and ethanol. Hierarchical structures were formed on an anodic copper surface by an alkali assistant oxidation process, water immersion and fluorination, the as-prepared surface exhibits superhydrophobic property. The creation of morphological structures and chemical compositions on the treated surface was revealed by scanning electron microscopy (SEM) and X-ray diffraction techniques. The resulting surfaces composing of Cu(OH)2 arrays demonstrates that water contact angle is as high as 165° and the rolling angle is less than 3°. The study is expected to create a new avenue for the basic research as well as real application.