An innovative method for joining materials at low temperature using silver (nano)particles derived from [AgO2C(CH2OCH2)3H]

A novel method for the manufacture of compact sintered silver layers as joining materials at low temperatures without applying pressure is described. The metal–organic silver complex [AgO2C(CH2OCH2)3H] (3) is used, which generates silver nanoparticles with heat treatment below 200 °C. Complex (3) provides the features for the formation of a molten metal-like silver phase in which silver particles in the nanometer and submicron size range, respectively, are completely miscible. Within this study, copper specimens were bonded, and the joints were evaluated by cross-sectional scanning electron microscope (SEM) images. Moreover, this approach enables the incorporation of copper. An example is given with an average amount of 20 at.% copper content in the silver layer.