Deposition characteristics of copper particles on roughened substrates through kinetic spraying

In this paper, a systematic study of copper particle deposition behavior on polished and roughened surfaces (aluminum and copper) in kinetic spray process has been performed. The particle deformation behavior was simulated through finite element analysis (FEA) software ABAQUS explicit 6.7–2. The particle–substrate contact time, contact temperature and contact area upon impact have been estimated for smooth and three different roughened substrate cases. Copper powders were deposited on smooth and grit-blasted copper and aluminium substrates and characterized through scanning electron microscopy and Romulus bond strength analyzer. The results indicate that the deformation and the resultant bonding were higher for the roughened substrates than that of smooth. The characteristic factors for bonding are reported and discussed. Thus the substrate roughness appears to be beneficial for the initial deposition efficiency of the kinetic spray process.