Title of article :
Preparation of thin Si:H films in an inductively coupled plasma reactor and analysis of their surface roughness
Author/Authors :
Wenfeng Zhao ، نويسنده , , Jun-fang Chen، نويسنده , , Ran Meng، نويسنده , , Yang Wang، نويسنده , , Hui Wang، نويسنده , , Chao-feng Guo، نويسنده , , Yong-qi Xue، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Pages :
4
From page :
2009
To page :
2012
Abstract :
An important concern in the deposition of Si:H films is to obtain smooth surfaces. Herein, we deposit the thin Si:H films using Ar-diluted SiH4 as feedstock gas in an inductively coupled plasma reactor. And we carry a real-time monitor on the deposition process by using optical emission spectrum technology in the vicinity of substrate and diagnose the Ar plasma radial distribution by Langmuir probe. Surface detecting by AFM and surface profilometry in large scale shows that the thin Si:H films have small surface roughness. Distributions of both the ion density and the electron temperature are homogeneous at h = 0.5 cm. Based on these experimental results, it can be proposed inductively coupled plasma reactor is fit to deposit the thin film in large scale. Also, Ar can affect the reaction process and improve the thin Si:H films characteristics.
Keywords :
ICP reactor , Thin Si:H film , Surface roughness
Journal title :
Applied Surface Science
Serial Year :
2010
Journal title :
Applied Surface Science
Record number :
1011749
Link To Document :
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