Electrochemical behaviors of the magnesium alloy substrates in various pretreatment solutions

Interface reactions and film features of AZ91D magnesium alloy in pickling, activation and zinc immersion solutions have been investigated. The surface morphologies of the specimens were observed with scanning electron microscope (SEM). Electrochemical behaviors of AZ91D magnesium alloy in the baths of pickling, activation and zinc immersion were analyzed based on the open circuit potential (OCP) - time curves in various solutions. The results show that the corrosive rate in HNO3 + CrO3 or HNO3 + H3PO4 pickling solution was more rapid than in KMnO4 pickling–activation solution. Both α phase and β phase of the substrates were uniformly corroded in HNO3 + CrO3 or HNO3 + H3PO4 pickling solution, the coarse surface can augment the mechanical occlusive force between the subsequent coatings and the substrates, so coatings with good adhesion can be obtained. In HF activation solution, the chromic compound formed via HNO3 + CrO3 pickling was removed and a compact MgF2 film was formed on the substrate surface. In K4P2O7 activation solution, the corrosion products formed via HNO3 + H3PO4 pickling were removed, a new thin film of oxides and hydroxides was formed on the substrate surface. In KMnO4 pickling–activation solution, a film of manganic oxides and phosphates was adhered on the substrate surface. Zinc film was symmetrically produced via K4P2O7 activation or KMnO4 pickling–activation, so it was good interlayer for Ni or Cu electroplating. Asymmetrical zinc film was produced because the MgF2 film obtained in the HF activation solution had strong adhesive attraction and it was not suitable for interlayer for electroplating. However, the substrate containing compact MgF2 film without zinc immersion was fit for direct electroless Ni–P plating.