A measurement of elastic moduli for tungsten films on polymer substrate using wrinkling analysis

The elastic moduli of ultra thin tungsten (W) films on polymers were assessed with wrinkling analysis. Thin W films with a range of thickness between 17 and 100 nm were deposited on compliant polymers and Si strips using DC magnetron sputtering method, causing the tensile stress in a few GPa scale with respect to the thickness of W films. By applying lateral compression on polymer, wrinkle patterns were developed in the W thin film with well-defined amplitude and wavelength. Using a simple equation on wrinkle analysis, the range of elastic moduli was estimated with increasing the thickness. It was found that the elastic modulus and the tensile stress decreased with increasing the film thickness.