Research

During thermal cycling, the residual stresses are often generated in the film/substrate bilayer due to the material mismatch between the substrate and the film. If the thickness of the film is relatively high, the thermal residual stresses in it may be of different signs. When the film is subjected to elastic–plastic deformation, two plastic zones with different thicknesses may be generated in the film at a significantly high temperature difference. In this paper, a theoretical model which reflects the complete history of thermal residual stresses and curvatures in the elastoplastic film/substrate bilayer system is developed. Solutions are derived to estimate the residual stresses and curvature in the film as functions of temperature difference. The case of Al/Si system is used to illustrate the implementation of this model. Results show that the critical temperature difference at which the second plastic zone near the film surface is generated near the Al film surface is dependent on the film thickness. The strain hardening of the film has an obvious influence on the magnitude of residual stresses within the film at high temperature difference.