Layer-by-layer deposition of Ti–4,4′-oxydianiline hybrid thin films

Features of the two thin-film techniques, atomic layer deposition (ALD) and molecular layer deposition (MLD), are combined to build up a stable novel inorganic–organic hybrid material of the (–Ti–N–C6H4–O–C6H4–N–)n type, deposited from successive pulses of TiCl4 and 4,4′-oxydianiline precursors. Depositions in the temperature range of 160–230 °C resulted in unstable films, while the films obtained in the temperature range of 250–490 °C were found stable in atmospheric air. The growth rate increased with increasing temperature, from 0.3 Å per cycle at 160 °C to 1.1 Å per cycle at 490 °C.