Non-destructive analysis of materials and devices by means of scanning acoustic microscopy

The position of scanning acoustic microscopy (SCAM) in the context of destructive versus non-destructive analytical techniques is discussed. The principle of SCAM is touched briefly to a level which will allow an understanding of the various examples of application presented in this article. Examples of SCAM applications will be reported (a) on different types of non-destructive analysis such as: detection of delaminations, voids and microcracks, grain structures, geometrical multilayer composition, strain detection and surface roughness and (b) samples from different fields of material science and technology: IC technology, metals, plastics and advanced materials (glass fibre reinforced composites). The message of this contribution is to focus attention on SCAM as a non-destructive, fast technique which can be used with success in selected cases, where additional information about the sample is present. However, theory of SCAM and hence interpretation of SCAM images is not straightforward and needs expert knowledge.