• Title of article

    Materials for thermal conduction

  • Author/Authors

    D.D.L. Chung، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2001
  • Pages
    13
  • From page
    1593
  • To page
    1605
  • Abstract
    Materials for thermal conduction are reviewed. They include materials exhibiting high thermal conductivity (such as metals, carbons, ceramics and composites), and thermal interface materials (such as polymer-based and silicate-based pastes and solder).
  • Keywords
    Thermal conduction , Thermal paste , Thermal contact , Thermal conductivity , Composite , Interface
  • Journal title
    Applied Thermal Engineering
  • Serial Year
    2001
  • Journal title
    Applied Thermal Engineering
  • Record number

    1023388

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=1023388