• Title of article

    Effect of electroplating on the thermal conductance of fin–tube interface

  • Author/Authors

    Wui-wai Cheng، نويسنده , , Chakravarti Madhusudana، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2006
  • Pages
    13
  • From page
    2119
  • To page
    2131
  • Abstract
    This paper presents the experimental results of thermal contact conductance, heat transfer and interfacial temperature drop of finned tube heat exchanger test specimens. The results were based on the measured temperatures at several locations on the test specimen so that the thermal contact conductance could be directly determined. Each test specimen was assembled by mechanically expanding seven tubes into a single fin. The geometry of the specimens was based on a commonly used model of heat exchangers. The specimens included one bare tube (non-coated) specimen and four electroplated tube specimens. The plating metals were zinc, tin, silver and gold. The thickness of the plating in each case was 5 μm. Experiments have been conducted in both vacuum and nitrogen. Maximum enhancement was obtained when the tube was coated with tin. This indicates that, although the thermal conductivity is important, the softness of the plating material also plays an important role in enhancing the thermal conductance of the interface. The presence of an interstitial gas such as nitrogen is beneficial for the heat transfer and the thermal contact conductance. It is also noted that the interfacial temperature drop alone does not fully reflect the efficiency of the heat exchanger.
  • Keywords
    Thermal contact resistance , Electroplating material , Bullet size , Thermal contact conductance , Interstitial gas , Fin–tube heat exchanger
  • Journal title
    Applied Thermal Engineering
  • Serial Year
    2006
  • Journal title
    Applied Thermal Engineering
  • Record number

    1040834