IMPEDANCE MATCHING CAPABILITY OF NOVEL SOCKET CONTACTOR DESIGN USING VARIABLE OPEN STUBFOR RF PACKAGING TESTING

In this paper, we will propose a new structure of the socket contactor, which is applied to the lead-frame test board. This structure contains a variable open stub to suffice for matching the impedance between the package and the load board. Its electrical property is considered superior to a conventional spring probeʹs especially when it is applied to a QFP device. In the following paragraphs, we will present its equivalent model and go into details. Note that the transmission-line model is a substitute for a physical structure at this point. First of all, its RLC model will be constructed after we demonstrate its simulation and test data. Finally, we will use the so-called MonteCarlo Method to analyze the inaccurate length in manufacturing to see how this new structure works.