Abstract :
Packaging of high-speed optical components is a complex process involving many interdisciplinary engineering efforts. The design of a packaged component is an interesting combination of optical, mechanical, electrical, and process engineering. This article shows how solving assembly and packaging problems can accelerate the progress in microsystem applications. In this article, automated assembly integrates over 50 specific functions into an array for a low-cost component. The techniques are applicable for other measurement microsystems in different fields of applications for measurement, control, and communications.
