• Title of article

    LTCC INTERCONNECT MODELING BY SUPPORT VECTOR REGRESSION

  • Author/Authors

    By L. Xia، نويسنده , , R.-M. Xu، نويسنده , , and B. Yan ، نويسنده ,

  • Issue Information
    ماهنامه با شماره پیاپی سال 2007
  • Pages
    9
  • From page
    67
  • To page
    75
  • Abstract
    In this paper, we introduce a new method: support vector regression (SVR) method to modeling low temperature co-fired ceramic (LTCC) multilayer interconnect. SVR bases on structural risk minimization (SRM) principle, which leads to good generalization abi
  • Journal title
    Progress In Electromagnetics Research
  • Serial Year
    2007
  • Journal title
    Progress In Electromagnetics Research
  • Record number

    1054351

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=1054351