Title of article :
THE OPTIMAL NUMBER AND LOCATION OF GROUNDED VIAS TO REDUCE CROSSTALK
Author/Authors :
By W.-T. Huang، نويسنده , , C.-H. Lu، نويسنده , , and D.-B. Lin ، نويسنده ,
Issue Information :
ماهنامه با شماره پیاپی سال 2009
Abstract :
Modern electronic products are increasingly based on high-speed, high-density circuitry operating at lower voltages. With such designs, the signal integrity (SI) in a poor printed circuit board layout is affected by noise and may become unstable. Crosstal
Journal title :
Progress In Electromagnetics Research
Journal title :
Progress In Electromagnetics Research