Title of article
THE OPTIMAL NUMBER AND LOCATION OF GROUNDED VIAS TO REDUCE CROSSTALK
Author/Authors
By W.-T. Huang، نويسنده , , C.-H. Lu، نويسنده , , and D.-B. Lin ، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 2009
Pages
26
From page
241
To page
266
Abstract
Modern electronic products are increasingly based on high-speed, high-density circuitry operating at lower voltages. With such designs, the signal integrity (SI) in a poor printed circuit board layout is affected by noise and may become unstable. Crosstal
Journal title
Progress In Electromagnetics Research
Serial Year
2009
Journal title
Progress In Electromagnetics Research
Record number
1054996
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