Rapid ultraviolet-curing of epoxy siloxane films

The ultraviolet (UV) curable epoxy siloxane polymer is shown to cross-link at low UV dosages of 130 mJ/cm2, making it desirable for use in nanoimprinting and the rapid fabrication of micro/nano-scaled patterns. In this paper, the dielectric and mechanical properties of this UV-cured epoxy siloxane polymer are investigated. The results of these tests show that the rapid UV-cured polymer films have a dielectric constant of 2.7 ± 0.13, leakage current density on the order of 10−9 A/cm2 under 1 MV/cm, dielectric strength of greater than 5 MV/cm, and a reduced modulus of elasticity of 6.2 GPa characterized using nanoindentation. These properties indicate that the epoxy siloxane can be used to fabricate layers for functional device applications.