Title of article
Effect of sodium dodecylsulfate and benzotriazole on the interfacial behavior of Cu/Cu(II), H2SO4
Author/Authors
R.F.V Villamil، نويسنده , , G.G.O Cordeiro، نويسنده , , J Matos، نويسنده , , E D’Elia، نويسنده , , S.M.L Agostinho، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2003
Pages
5
From page
448
To page
452
Abstract
The effect of sodium dodecylsulfate (SDS) on copper corrosion in sulfuric acid media has been studied in the absence and presence of benzotriazole (BTAH), at room temperature using electrochemical impedance and surface tension (γ) measurements. SDS provides a slight inhibition of copper corrosion, however, it promotes synergistic effect on the inhibitive action of BTAH, when stationary copper electrode is used. SDS does not change the copper dissolution mechanism in sulfuric acid media at the corrosion potential but it reduces significantly the inhibitive effect of BTAH on the copper corrosion in H2SO4 media under hydrodynamical conditions. The interaction of BTAH–SDS was also observed at H2SO4 solution/air interface where the BTAH presence increases the SDS effect on the decreasing of surface tension values.
Keywords
copper , Electrodissolution , Sodium dodecylsulfate , Electrochemical impedance , Benzotriazole
Journal title
Materials Chemistry and Physics
Serial Year
2003
Journal title
Materials Chemistry and Physics
Record number
1061141
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