(Cu, Fe, Co, or Ni)-doped tin dioxide films deposited by spray pyrolysis: Doping influence on thermal stability of the film structure

The results of doping influence on thermal stability of the SnO2 film morphology are presented in this article. The SnO2 films doped by Fe, Cu, Ni, Co (16 at.%) were deposited by spray pyrolysis from 0.2 M SnCl4–water solution at Tpyr 350–450 °C. The annealing at 850–1030 °C was carried out in the atmosphere of the air. The change of such parameters as film morphology, the grain size, texture and the intensity of X-ray diffraction (XRD) peaks have been controlled. For structural analysis of tested films we have been using X-ray diffraction, Scanning Electron Microscopy (SEM), and Atomic Force Microscopy (AFM) techniques. It was established that the doping does not improve thermal stability of both film morphology and the grain size. It was made a conclusion that the increased contents of the fine dispersion phase of tin oxide in the doped metal oxide films, and the coalescence of this phase during thermal treatment are the main factors, responsible for observed changes in the morphology of the doped SnO2 films.