Effects of organic additives on preferred plane and residual stress of copper electroplated on polyimide

Effects of the preferred plane and the residual stress of an electroplated copper on polyethylene glycol (PEG) and 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid (DPS) were studied. Polyimide film coated with sputtered copper was used as a substrate. Preferred plane, residual stress, and impurity level in the electroplated copper were measured by an X-ray diffractometry (XRD), calculated by Stoneyʹs equation, and analyzed with secondary ion mass spectroscopy (SMS), respectively. With increasing the concentration of PEG, the preferred plane changed in the order (1 0 0) and (1 1 0) while with increasing the concentration of DPS, the preferred plane changed in the order (1 1 0), (1 0 0), and (1 1 1). Based on the modified preferred growth model, where the amount of additive adsorbed on a plane is newly assumed to be proportional to its surface energy in vacuum, the predicted preferred planes correspond to the experimental results. The residual stress of the electroplated copper depended on the type of additive as well as its concentration but was independent of the preferred plane. For example, PEG and DPS induced tensile and compressive residual stresses in the electroplated copper, respectively, and their magnitudes increased with their concentrations. The dependency of residual stress on the additives was explained by the incorporated additives into the electroplated copper.