Influence of rapid thermal annealing effect on electrical and structural properties of Pd/Ru Schottky contacts to n-type GaN

Pd/Ru metallization scheme is fabricated on n-GaN as a Schottky contact, and the electrical and structural properties have been investigated as a function of annealing temperature by current–voltage (I–V), capacitance–voltage (C–V), X-ray photoelectron spectroscopy (XPS) and X-ray diffraction (XRD) measurements. As-deposited Ru/Pd/n-GaN contact yielded Schottky barrier height (SBH) of 0.67 eV (I–V) and 0.79 eV (C–V), respectively. Further, it is observed that the Schottky barrier height increases to 0.80 eV (I–V) and 0.96 eV (C–V) for the contact annealed at 300 °C. However, both I–V and C–V measurements indicate that the barrier height slightly decreased when the contacts are annealed at 400 °C and 500 °C. From the above observations, the optimum annealing temperature for Pd/Ru Schottky contact is 300 °C. Norde method is also employed to extract the barrier height of Pd/Ru Schottky contacts which are in good agreement with those obtained by the I–V technique. X-ray photoelectron spectroscopy results shows that the Ga 2p core-level shift towards the low-energy side for the contact annealed at 300 °C compared to the as-deposited contact. Based on the XPS and XRD results, the reason for the increase in SBH upon annealing at 300 °C could be attributed to the formation of gallide phases at the Ru/Pd/n-GaN interface vicinity. The AFM results showed that the overall surface morphology of the Pd/Ru Schottky contacts on n-GaN is fairly smooth. The above observations reveal that the Pd/Ru Schottky contact is attractive for high-temperature device applications.