Title of article :
The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes
Author/Authors :
R. Durairaj، نويسنده , , Lam Wai Man، نويسنده , , N.N. Ekere، نويسنده , , S. Mallik، نويسنده ,
Issue Information :
ماهنامه با شماره پیاپی سال 2010
Abstract :
Wall-slip plays an important role in the flow behaviour of solder paste materials. The wall-slip arises due to the various attractive and repulsive forces acting between the solder particles and the walls of the measuring geometry. These interactions could lead to the presence of a thin liquid layer adjacent to the wall, which causes slippage. The aim of this study is to investigate the influence of the solder paste formulation on wall-slip formation and its effect on the printability of these pastes material. A wall-slip model is utilised to calculate the true viscosity and slip velocity for the lead-free solder pastes samples used in this study. The difference in the measured viscosity and the true viscosity could indicate wall-slip formation between the solder pastes and the parallel plate. Sample P1 showed a higher slip velocity compared to sample P2. The slip velocity calculated for the solder pastes could be used as a performance indicator to understand the paste release characteristics in the stencil printing process.
Keywords :
Lead-free , Solder Paste , Viscosity , Wall-slip , Stencil printing process , Rheology
Journal title :
Materials and Design
Journal title :
Materials and Design