Acid colloidal silica slurry for Cu CMP

Semi-abrasive free slurry for copper chemical mechanical planarisation (CMP) with below 0.5% acid colloidal silica provides good hydrogen peroxide stability, excellent colloidal silica dispersion ability and easiness of post-CMP cleaning. This approach may be useful for the application of singleand first-step copper CMP slurry with one package system.