Experimental analysis of the strength of silver–alumina junction elaborated at solid state bonding

The mechanisms of ceramics–metal assemblies, particularly silver and alumina, can be better understood by studying the strength of their adhesion. These two materials are a priori non-reactive, their thermodynamic work of adhesion is low and the difference between their thermal coefficients of expansion in very considerable. In this study, the strength of silver–alumina junctions elaborated at solid state by thermo-compression is tested by an indirect tensile test and shearing one. The effects of several parameters such as: the pressure of bonding, the time of bonding, the temperature, and the oxygen dissolve in metal solid solution on the strength of the junction are analyzed. The obtained results show that the resistance of the junction is affected by all this parameters and it is essential to optimize these different parameters in order to increase the durability of the junction. It was also shown that the diffusion of the silver in alumina could be the cause of the damage of alumina near the interface.