• Title of article

    A finite element analysis of thermal relaxation of residual stress in laser shock processing Ni-based alloy GH4169

  • Author/Authors

    X.D. Ren، نويسنده , , Q.B. Zhan، نويسنده , , S.Q. Yuan، نويسنده , , J.Z. Zhou، نويسنده , , Y. Wang، نويسنده , , N.F. Ren، نويسنده , , G.F. Sun، نويسنده , , L.M. Zheng، نويسنده , , F.Z. Dai، نويسنده , , H.M. Yang، نويسنده , , W.J. Dai، نويسنده ,

  • Issue Information
    ماهنامه با شماره پیاپی سال 2014
  • Pages
    4
  • From page
    708
  • To page
    711
  • Abstract
    The residual stress induced by laser shock processing and the thermal relaxation behaviors of residual stress in Ni-based alloy GH4169 were investigated by means of three-dimensional nonlinear finite element analysis. To study the effect of different given exposure time and different temperatures on residual stress in laser shock processing Ni-based alloy GH4169, Johnson–Cook material model was used in order to account for the nonlinear constitutive behavior. The influence of heating temperature and exposure time on the stress thermal relaxation was studied. It was concluded that stress relaxation mainly occured during the initial period of exposure, and the degree of relaxation increased as the temperature risen. The results would provide a theoretical basis for controlling the laser shock processing and guiding subsequent experiments.
  • Keywords
    Laser shock processing , Ni-based alloy , Residual stress , Thermal relaxation , Finite element analysis
  • Journal title
    Materials and Design
  • Serial Year
    2014
  • Journal title
    Materials and Design
  • Record number

    1073841