Title of article
Effect of aggregation and interfacial thermal resistance on thermal conductivity of nanocomposites and colloidal nanofluids
Author/Authors
William Evans، نويسنده , , Ravi Prasher، نويسنده , , Jacob Fish، نويسنده , , Paul Meakin، نويسنده , , Patrick Phelan d، نويسنده , , PAWEL KEBLINSKI، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2008
Pages
8
From page
1431
To page
1438
Abstract
We analyzed the role of aggregation and interfacial thermal resistance on the effective thermal conductivity of nanofluids and nanocomposites. We found that the thermal conductivity of nanofluids and nanocomposites can be significantly enhanced by the aggregation of nanoparticles into clusters. The value of the thermal conductivity enhancement is determined by the cluster morphology, filler conductivity and interfacial thermal resistance. We also compared thermal conductivity enhancement due to aggregation with that associated with high-aspect ratio fillers, including fibers and plates.
Keywords
Monte Carlo simulation , Nanoparticles , Homogenization model , Thermal conductivity , Interfacial thermal resistance , aggregation
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Serial Year
2008
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Record number
1075297
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