Author/Authors :
Y.-J.، Seo, نويسنده , , N.-H.، Kim, نويسنده , , W.-S.، Lee, نويسنده ,
Abstract :
Abrasive powder was collected and annealed so that it could be used to promote the mechanical strength of reduced abrasion force. Chemical mechanical polishing characteristics between self-developed KOH-based silica abrasive slurry and original slurry were investigated. Experimental results showed comparable removal rate and good planarity with commercial products.