Title of article
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
Author/Authors
Guoshun Pan، نويسنده , , Zhonghua Gu، نويسنده , , Yan Zhou، نويسنده , , Tuo Li، نويسنده , , Hua Gong، نويسنده , , Yan Liu، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 2011
Pages
5
From page
100
To page
104
Abstract
Surface modified SiO2 particles in an aqueous environment with γ-aminopropyl triethoxysilane (APTS)/methyl trimethoxysilane (MTMOS) are introduced as abrasive in the slurry. The modified silica particles are characterized by Particle Size/Zeta Potential Analysis, Fourier Transform Infrared Spectroscopy (FTIR), Thermal Gravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). In addition, the enhancement of polishing rate owning to the modified silicon particles in silicon wafer Chemical Mechanical Polishing (CMP) is observed.
Keywords
Chemical mechanical polishing (CMP) , Silicon wafer , SiO2
Journal title
Wear
Serial Year
2011
Journal title
Wear
Record number
1092342
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