Thermal Degradation and Decomposition Products of Electronic Boards Containing BFRs

Production of electronic boards containing brominated flame retardants is constantly increasing, posing important problems with disposal of products containing these materials. The present study investigated the thermal degradation behavior of electronic boards manufactured using tetrabromobisphenol A and diglycidyl ether of bisphenol A epoxy resins. Qualitative and quantitative information was obtained on the products formed in the thermal degradation process, and the bromine distribution in the different product fractions was determined. The more important decomposition products included hydrogen bromide, phenol, polybrominated phenols, and polybrominated bisphenol A species. The formation of considerable amounts of hydrogen bromide and high-molecular-weight organobrominated compounds, as well as the potential formation of limited quantities of polybrominated dibenzo-p-dioxins and dibenzofurans, is an important element of concern in the safety and environmental assessment of the thermal degradation processes of electronic boards containing brominated flame retardants.