Title of article
Microstrain effect on thermal properties of nanocrystalline Cu Original Research Article
Author/Authors
L.H. Qian، نويسنده , , S.C. Wang، نويسنده , , K. Lu and Y.H. Zhao، نويسنده , , K. Lu، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2002
Pages
10
From page
3425
To page
3434
Abstract
The nanocrystalline (nc) Cu samples with different microstrains but the same grain size were obtained by annealing a magnetron-sputtered nc Cu specimen. Quantitative X-ray diffraction (XRD) measurements show that with an increment of the microstrain from 0.14 to 0.24% the thermal expansion coefficient (TEC) of crystalline lattice increases by about 12%, the static displacement of atom from the equilibrium position (BS) increases from 0.47±0.09 to 1.16±0.15 Å2, and Debye characteristic temperature (D) decreases from 307.1±3.1 to 279.2±2.8 K. The microstrain effect on thermal properties in the nc Cu might be attributed to the change in density of grain boundary defects/dislocations. The present investigation demonstrates that the thermal properties of nc materials are determined by not only the grain size but also the microstructure of grain boundaries.
Keywords
Magnetron sputtering , X-ray diffraction (XRD) , Nanocrystalline copper , Thermal properties
Journal title
ACTA Materialia
Serial Year
2002
Journal title
ACTA Materialia
Record number
1139985
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