• Title of article

    Microstrain effect on thermal properties of nanocrystalline Cu Original Research Article

  • Author/Authors

    L.H. Qian، نويسنده , , S.C. Wang، نويسنده , , K. Lu and Y.H. Zhao، نويسنده , , K. Lu، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2002
  • Pages
    10
  • From page
    3425
  • To page
    3434
  • Abstract
    The nanocrystalline (nc) Cu samples with different microstrains but the same grain size were obtained by annealing a magnetron-sputtered nc Cu specimen. Quantitative X-ray diffraction (XRD) measurements show that with an increment of the microstrain from 0.14 to 0.24% the thermal expansion coefficient (TEC) of crystalline lattice increases by about 12%, the static displacement of atom from the equilibrium position (BS) increases from 0.47±0.09 to 1.16±0.15 Å2, and Debye characteristic temperature (D) decreases from 307.1±3.1 to 279.2±2.8 K. The microstrain effect on thermal properties in the nc Cu might be attributed to the change in density of grain boundary defects/dislocations. The present investigation demonstrates that the thermal properties of nc materials are determined by not only the grain size but also the microstructure of grain boundaries.
  • Keywords
    Magnetron sputtering , X-ray diffraction (XRD) , Nanocrystalline copper , Thermal properties
  • Journal title
    ACTA Materialia
  • Serial Year
    2002
  • Journal title
    ACTA Materialia
  • Record number

    1139985