Direct observation of the behavior of grain boundaries during continuous dynamic recrystallization in an Al–4Mg–0.3Sc alloy Original Research Article

The micromechanisms operating during dynamic continuous recrystallization of an Al–4Mg–0.3Sc alloy have been studied in real time by reloading pre-deformed samples at temperature in situ in the transmission electron microscope. The processes responsible for the evolution of the microstructure include the migration and breakup of subgrain boundaries, the destruction of triple junctions, and large-scale volume rotations. These observations are considered in terms of the micromechanisms proposed previously to account for dynamic continuous recrystallization.