Title of article
A parametric study of the stress state of thermal barrier coatings Part II: cooling stresses Original Research Article
Author/Authors
M. B?ker، نويسنده , , J. R?sler، نويسنده , , G. Heinze، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
8
From page
469
To page
476
Abstract
The development of cooling stresses in the thermal barrier coating (TBC)/thermally grown oxide (TGO)/bond coat interface region is calculated for a TBC coated superalloy specimen using a finite element model. Stresses in the system are determined by the thermal mismatch between the components, with the TGO and the bond coat having an opposing effect on the TBC stresses. It is shown that TGO induced stresses dominate even at a moderate TGO layer thickness. Creep processes strongly influence the cooling stresses, and fast creep in TBC and bond coat significantly reduces TBC stresses, possibly leading to a substantial increase in TBC lifetime. The influence of the interface geometry and of bond coat plasticity on the cooling stresses are also studied.
Keywords
Plasma spraying , Thermal barrier coating , Thin films , Creep , Finite element analysis
Journal title
ACTA Materialia
Serial Year
2005
Journal title
ACTA Materialia
Record number
1141197
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