Title of article
Tensile properties of in situ consolidated nanocrystalline Cu Original Research Article
Author/Authors
S. Cheng، نويسنده , , E. Ma، نويسنده , , Y.M. Wang، نويسنده , , L.J. Kecskes، نويسنده , , Hosam K.M. Youssef، نويسنده , , C.C. Koch، نويسنده , , U.P. Trociewitz، نويسنده , , K. Han، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2005
Pages
13
From page
1521
To page
1533
Abstract
We have prepared Cu powders with nanocrystalline grain sizes via ball milling at liquid nitrogen temperature. An in situ consolidation technique was used to produce fully dense nanocrystalline Cu samples centimeters in lateral dimensions and about one millimeter in thickness. We report a much improved combination of tensile strength and ductility, over the tensile properties of other nanocrystalline Cu materials documented in the literature. We also demonstrate the elevated strain rate sensitivity and strong temperature dependence of the flow stress and explain the results in terms of the thermally activated deformation mechanisms operative in the nanocrystalline grains. The nearly perfectly plastic behavior and shear localization observed are discussed and compared with the strain hardening behavior and deformation modes known for other nanocrystalline metals.
Keywords
Nanocrystalline , copper , Deformation mechanism , Mechanical property , Consolidation
Journal title
ACTA Materialia
Serial Year
2005
Journal title
ACTA Materialia
Record number
1141294
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