Title of article :
Effect of stress and strain state on heterogeneous coarsening in Sn–Pb solder Original Research Article
Author/Authors :
M.W. Woodmansee، نويسنده , , R.W. Neu، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2006
Pages :
11
From page :
197
To page :
207
Abstract :
The effect of three basic stress states on the deformation and heterogeneous coarsening behavior of 60Sn–40Pb is investigated experimentally. Three different initial microstructures are considered. The response of these microstructures under uniaxial compression, pure shear and hydrostatic compression at 125 °C is evaluated on length scales ranging from micrometers to millimeters. Inelastic shear strain concentrations correlate strongly with regions where heterogeneously coarsened bands form. Inelastic deformation precedes accelerated coarsening and damage accumulation at this temperature. Acceleration of coarsening is closely associated with deviatoric strain, while purely volumetric strain has little impact on accelerated coarsening.
Keywords :
Creep , Recrystallized microstructure , Mechanical properties testing , Coarsening
Journal title :
ACTA Materialia
Serial Year :
2006
Journal title :
ACTA Materialia
Record number :
1141666
Link To Document :
بازگشت