Phase transformations in Al–Cu thin films: precipitation and copper redistribution Original Research Article

The (micro-)structural changes occurring in thin Al–Cu films of about 500 nm thickness and containing up to 1 at% Cu have been investigated. In particular, the copper distribution and the precipitation behaviour have been studied in situ during thermal cycling between 323 and 773 K. After slow cooling, large second-phase particles are observed which are mostly located at grain boundary triple points; the shape and size depend on the copper concentration. The average distance between these particles is about 16 μm, which is larger than the average grain size of approximately 1 μm. No second-phase particles have been observed within the aluminium grains. After cooling, a relatively large amount of copper (about 0.2 at%) as compared with bulk Al–Cu (0.001 at%) is not contained in second-phase particles. Most likely, this copper has segregated at grain boundaries, interfaces and dislocations. The temperature at which Al2Cu starts to form in the thin films is well below the copper solvus for bulk material.