Title of article
Grain boundary diffusion and segregation of Ni in Cu Original Research Article
Author/Authors
Sergiy Divinski، نويسنده , , Jens Ribbe، نويسنده , , Guido Schmitz، نويسنده , , Christian Herzig، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2007
Pages
10
From page
3337
To page
3346
Abstract
Grain boundary (GB) diffusion of 63Ni in polycrystalline Cu was investigated by the radiotracer technique in an extended temperature interval from 476 to 1156 K. The independent measurements in Harrison’s C and B kinetic regimes resulted in direct data of the GB diffusivity Dgb and of the so-called triple product P = s · δ · Dgb (s and δ are the segregation factor and the diffusional GB width, respectively). Arrhenius-type temperature dependencies for both the Dgb and P values were measured, resulting in the pre-exponential factors image m2 s−1 and P0 = 1.89 × 10−16 m3 s−1 and the activation enthalpies of 90.4 and 73.8 kJ mol−1, respectively. Although Ni is completely soluble in Cu, it reveals a distinct but still moderate ability to segregate copper GBs with a segregation enthalpy of about −17 kJ mol−1.
Keywords
copper , Grain boundary segregation of nickel , Grain boundary diffusion of nickel
Journal title
ACTA Materialia
Serial Year
2007
Journal title
ACTA Materialia
Record number
1143031
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