Title of article :
Peritectic solidification of Cu–Sn alloys: Microstructural competition at low speed Original Research Article
Author/Authors :
Matthew F. Kohler، نويسنده , , L. Germond، نويسنده , , Georges H. Wagnière، نويسنده , , M. Rappaz، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2009
Pages :
13
From page :
56
To page :
68
Abstract :
Directional solidification experiments on Cu–Sn peritectic alloys have been conducted at very low velocity in a high-thermal-gradient Bridgman furnace. The size of the samples has been reduced in order to decrease natural convection and the associated macrosegregation. At the lowest growth rates (0.5 and 0.58 μm s−1), eutectic-like α + β lamellar structures have been observed in near-peritectic composition alloys over several millimeters of growth. These structures resulted from a destabilization of a band structure in which α- and β-phases overlay each other. Electron backscattered diffraction measurements revealed that bands and lamellae of a solid phase are continuous and originate from a single nucleus.
Keywords :
Cooperative growth , Directional solidification , Copper alloys , Nucleation and growth , Peritectic solidification
Journal title :
ACTA Materialia
Serial Year :
2009
Journal title :
ACTA Materialia
Record number :
1143992
Link To Document :
بازگشت