Structure of martensite in sputter-deposited (Ni,Cu)-rich Ti–Ni–Cu thin films containing Ti(Ni,Cu)2 precipitates Original Research Article

The martensite structure in sputter-deposited thin films of Ti48.6Ni35.9Cu15.5 was studied. The Ti(Ni,Cu)2 phase precipitates during the annealing process. Fine Ti(Ni,Cu)2 precipitates can be deformed by the shear deformation of martensitic transformation, but they obstruct the movement of the twin boundaries to some extent. Coarse Ti(Ni,Cu)2 precipitates seriously impede the growth of martensite plates and lead to a rectangular-cell-like structure of martensite in the film annealed at 873 K. The resistance of Ti(Ni,Cu)2 precipitates to the growth of the martensite plates enhances with the coarsening of Ti(Ni,Cu)2 precipitates, which is one of the reasons for the decrease in the maximum recoverable strain with increasing annealing temperature. B19′ martensite with (0 0 1) compound twinning is frequently observed near coarse Ti(Ni,Cu)2 precipitates and grain boundaries in films annealed at 873 and 973 K. The local stress concentration should be responsible for the presence of B19′ martensite.