Investigation of thermoelectric magnetic convection and its effect on solidification structure during directional solidification under a low axial magnetic field Original Research Article

Thermoelectric magnetic convection (TEMC) at the scale of both the sample (L = 3 mm) and the cell/dendrite (L = 100 μm) was numerically and experimentally examined during the directional solidification of Al–Cu alloy under an axial magnetic field (image). Numerical results show that TEMC on the sample scale increases to a maximum when B is of the order of 0.1 T, and then decreases as B increases further. However, at the cellular/dendritic scale, TEMC continues to increase with increasing magnetic field intensity up to a field of 1 T. Experimental results show that application of the magnetic field caused changes in the macroscopic interface shape and the cellular/dendritic morphology (i.e. formation of a protruding interface, decrease in the cellular spacing, and a cellular–dendritic transition). Changes in the macroscopic interface shape and the cellular/dendritic morphology under the magnetic field are in good agreement with the computed velocities of TEMC at the scales of the macroscopic interface and cell/dendrite, respectively. This means that changes in the interface shape and the cellular morphology under a lower magnetic field should be attributed respectively to TEMC on the sample scale and the cell/dendrite scale. Further, by investigating the effect of TEMC on the cellular morphology, it has been proved experimentally that the convection will reduce the cellular spacing and cause a cellular–dendritic transition.