• Title of article

    Dihedral angles in Cu–1 wt.% Pb: Grain boundary energy and grain boundary triple line effects Original Research Article

  • Author/Authors

    D. Empl، نويسنده , , L. FELBERBAUM، نويسنده , , V. Laporte، نويسنده , , D. Chatain، نويسنده , , A. Mortensen، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2009
  • Pages
    11
  • From page
    2527
  • To page
    2537
  • Abstract
    The dihedral angle shown by intergranular lead inclusions in Cu–1 wt.% Pb alloys is measured varying the purity of the metal and the temperature. Several measurement methods are used and compared, namely classical two-dimensional (2D) methods based on metallurgical cross-section analysis and a recently developed 3D stereoscopic method that yields the true three-dimensional angle value for individual inclusions straddling a flat grain boundary. We confirm and extend earlier measurements using the new method. We show that a discrepancy found between the literature data and the stereoscopic 3D dihedral angle measurements is not caused by impurity effects. Rather, the data indicate that the discrepancy has its origin in a difference in average dihedral angle values measured between inclusions straddling two grains and values found at inclusions located where three or more grains meet.
  • Keywords
    Capillary phenomena , copper , Grain boundary energy , Grain boundary wetting , Triple junction
  • Journal title
    ACTA Materialia
  • Serial Year
    2009
  • Journal title
    ACTA Materialia
  • Record number

    1144238