Title of article :
Measurement of grain boundary triple line energy in copper Original Research Article
Author/Authors :
B. Zhao ، نويسنده , , J.Ch. Verhasselt، نويسنده , , L.S Shvindlerman، نويسنده , , G. Gottstein، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2010
Abstract :
Recent studies have demonstrated that grain boundary triple junctions are crystal defects with specific thermodynamic and kinetic properties. In this study we address the energy of triple lines. Previously, a geometrical model was proposed to determine the grain boundary line tension. The current study introduces a thermodynamically correct approach which allows direct and precise measurement of the triple line energy. The experimental technique utilizes the measurement of the surface topography of a crystal in the vicinity of a triple junction by atomic force microscopy. The grain boundary triple line tension image of a random triple line in a copper tricrystal was measured to be 6.3 ± 2.8 × 10−9 J m–1.
Keywords :
Grain boundary , Triple junction , Line tension of boundary triple junction
Journal title :
ACTA Materialia
Journal title :
ACTA Materialia