• Title of article

    High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model Original Research Article

  • Author/Authors

    M.-S. Colla، نويسنده , , B. Wang، نويسنده , , H. Idrissi، نويسنده , , L. Toth and D. Schryvers، نويسنده , , J.-P. Raskin، نويسنده , , T. Pardoen، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2012
  • Pages
    12
  • From page
    1795
  • To page
    1806
  • Abstract
    The mechanical behaviour of thin nanocrystalline palladium films with an ∼30 nm in plane grain size has been characterized on chip under uniaxial tension. The films exhibit a large strain hardening capacity and a significant increase in the strength with decreasing thickness. Transmission electron microscopy has revealed the presence of a moderate density of growth nanotwins interacting with dislocations. A semi-analytical grain aggregate model is proposed to investigate the impact of different contributions to the flow behaviour, involving the effect of twins, of grain size and of the presence of a thin surface layer. This model provides guidelines to optimizing the strength/ductility ratio of the films.
  • Keywords
    Nanocrystalline film , Twinning , Tensile testing , Strengthening mechanism , Analytical modelling
  • Journal title
    ACTA Materialia
  • Serial Year
    2012
  • Journal title
    ACTA Materialia
  • Record number

    1146187