Title of article :
High strength-ductility of thin nanocrystalline palladium films with nanoscale twins: On-chip testing and grain aggregate model Original Research Article
Author/Authors :
M.-S. Colla، نويسنده , , B. Wang، نويسنده , , H. Idrissi، نويسنده , , L. Toth and D. Schryvers، نويسنده , , J.-P. Raskin، نويسنده , , T. Pardoen، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2012
Pages :
12
From page :
1795
To page :
1806
Abstract :
The mechanical behaviour of thin nanocrystalline palladium films with an ∼30 nm in plane grain size has been characterized on chip under uniaxial tension. The films exhibit a large strain hardening capacity and a significant increase in the strength with decreasing thickness. Transmission electron microscopy has revealed the presence of a moderate density of growth nanotwins interacting with dislocations. A semi-analytical grain aggregate model is proposed to investigate the impact of different contributions to the flow behaviour, involving the effect of twins, of grain size and of the presence of a thin surface layer. This model provides guidelines to optimizing the strength/ductility ratio of the films.
Keywords :
Nanocrystalline film , Twinning , Tensile testing , Strengthening mechanism , Analytical modelling
Journal title :
ACTA Materialia
Serial Year :
2012
Journal title :
ACTA Materialia
Record number :
1146187
Link To Document :
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