• Title of article

    Thermal stability and strength of deformation microstructures in pure copper Original Research Article

  • Author/Authors

    C. Saldana، نويسنده , , A.H King، نويسنده , , S. Chandrasekar، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2012
  • Pages
    10
  • From page
    4107
  • To page
    4116
  • Abstract
    The plastic flow field produced by machining is utilized to access a range of deformation parameters in pure copper: strains of 1–7, strain rates of 1–1000 s−1 and temperatures as low as 77 K. The strength and stability of the severe plastic deformation microstructures including cellular, elongated, equiaxed and twinned types are characterized. Unique combinations of strengthening and stability are identified in the case of heavily twinned microstructures. These observations offer insights for improving the stability of both single-phase and multicomponent ultrafine-grained alloys.
  • Keywords
    Ultrafine-grained (UFG) microstructure , Deformation twinning , Nanocrystalline Cu , Severe plastic deformation
  • Journal title
    ACTA Materialia
  • Serial Year
    2012
  • Journal title
    ACTA Materialia
  • Record number

    1146399