Title of article :
Crack propagation behavior of Sn–3.5Ag solder in low cycle fatigue
Author/Authors :
Mineo Nozaki، نويسنده , , Masao Sakane، نويسنده , , Yutaka Tsukada، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2008
Pages :
8
From page :
1729
To page :
1736
Abstract :
This work studies the low cycle fatigue crack propagation for three types of notched specimens of Sn–3.5Ag lead free solder. Low cycle fatigue tests were carried out using circumferential notched specimens. The fatigue life for crack initiation and propagation were experimentally obtained. The applicability of stress intensity factor range, J-integral range and strain intensity factor range for correlating the crack propagation rates was discussed. It was observed that the three fracture mechanics parameters did not correlate the crack propagation rates in a whole propagation stage with a small scatter but the stress intensity factor and J-integral ranges correlated the saturated crack propagation rates with a small scatter.
Keywords :
crack propagation , Stress intensity factor , J-integral , Strain intensity factor , Low cycle fatigue
Journal title :
INTERNATIONAL JOURNAL OF FATIGUE
Serial Year :
2008
Journal title :
INTERNATIONAL JOURNAL OF FATIGUE
Record number :
1161719
Link To Document :
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