Title of article :
Microstructure and fatigue crack growth mechanisms in high temperature titanium alloys
Author/Authors :
Hamouda Ghonem، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Pages :
13
From page :
1448
To page :
1460
Abstract :
This paper examines the influence of microstructure on the crack growth behavior in high temperature titanium alloys. A focus is made on the concept that the fracture mechanisms in these alloys are governed by the slip process taking place within the crack tip region. This concept is applied to Widmanstätten and fully lamellar microstructures in order to explain the different fracture modes observed under effects of the loading frequency and temperature. In the Widmanstätten microstructure, it is proposed that interactions of slip bands with both the colony boundary and the grain boundary result in transcolony and intergranular fracture, respectively. The selectivity of either boundary is correlated with the loading frequency and the ensuing hardening on the active slip planes. This mechanism has been validated through crack growth experiments preformed on a Widmanstätten microstructure that has been modified through the precipitation of internal slip barriers. In fully lamellar microstructure, the predominant transgranular fracture occurring along heavily shear slip bands is categorized in terms of the angle between the corresponding crack path and the lamella long axis direction within a single colony. The dominant parallel- and transverse-to-lamella crack directions are shown to be governed by slip along the a1 and a2-prism directions of the α phase. Variations in the critical resolved shear stress along these two slip directions, and thus, the selectivity of the crack path direction is described as a function of temperature and loading frequency.
Keywords :
Crack growth rate , Silicide preci , Widmanst?tten microstructure , Intergranular fracture , Transgranular fracture , Slip , Loading frequency , Lamellar microstructure , Titanium alloys , ?/? interface , High temperature
Journal title :
INTERNATIONAL JOURNAL OF FATIGUE
Serial Year :
2010
Journal title :
INTERNATIONAL JOURNAL OF FATIGUE
Record number :
1162144
Link To Document :
بازگشت