Plastic deformation behavior analysis of an electrodeposited copper thin film under fatigue loading

This paper presents a method for estimating the fatigue life of an electrodeposited copper film. From fatigue tests at various mean stresses, the monotonic plastic strain (ratcheting strain) was found to be directly related to fatigue damage, and could be used as a measure of the damage. Accordingly, in this study, monotonic plastic strain (ratcheting strain) behavior, and hence also fatigue damage, is analyzed via the Weibull distribution function, and the fatigue life of a copper thin film is estimated. In addition, a master curve for the fatigue life of the copper thin film is derived.