Application of Kriging and radial basis function in power electronic module wire bond structure reliability under various amplitude loading

This paper discusses life time prediction of wire bond structure in a power electronic module based on computational approach that integrates methods for high fidelity analysis, reduced order modelling, and life time prediction using reduced order model. This methodology is demonstrated for the design of a wire bond structure in a power electronic module with aim of reducing the chance of failure due to the wire bond lift off in power electronic module when a random load is applied to the aluminium wire. In particular, wire bond reliability of the power module related to the thermal fatigue material degradation of aluminium wire is one of the main concerns. In the power electronic module reliability, understanding the performance, reliability and robustness of wire bond is a key factor for the future development and success of the power electronic module technology, because wire bond lift off failure ignites other catastrophic failures.