• Title of article

    Thermal conductance measurements of bolted copper to copper joints at sub-Kelvin temperatures Original Research Article

  • Author/Authors

    I. Didschuns، نويسنده , , A.L. Woodcraft، نويسنده , , D. Bintley، نويسنده , , P.C. Hargrave، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2004
  • Pages
    7
  • From page
    293
  • To page
    299
  • Abstract
    We have measured the thermal contact conductance of several demountable copper joints below 1 K. Joints were made by bolting together either two flat surfaces or a clamp around a rod. Surfaces were gold plated, and no intermediate materials were used. A linear dependence on temperature was seen. Most of the measured conductance values fell into a narrow range: 0.1–0.2 W K−1 at 1 K. Results in the literature for similar joints consist of predictions based on electrical resistance measurements using the Wiedemann–Franz law. There is little evidence of the validity of this law in the case of joints. Nevertheless, our results are in good agreement with the literature predictions, suggesting that such predictions are a reasonable approximation.
  • Keywords
    Sub-Kelvin , Contact conductance , copper
  • Journal title
    Cryogenics
  • Serial Year
    2004
  • Journal title
    Cryogenics
  • Record number

    1172433