Title of article
Thermal conductance measurements of bolted copper to copper joints at sub-Kelvin temperatures Original Research Article
Author/Authors
I. Didschuns، نويسنده , , A.L. Woodcraft، نويسنده , , D. Bintley، نويسنده , , P.C. Hargrave، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2004
Pages
7
From page
293
To page
299
Abstract
We have measured the thermal contact conductance of several demountable copper joints below 1 K. Joints were made by bolting together either two flat surfaces or a clamp around a rod. Surfaces were gold plated, and no intermediate materials were used. A linear dependence on temperature was seen. Most of the measured conductance values fell into a narrow range: 0.1–0.2 W K−1 at 1 K. Results in the literature for similar joints consist of predictions based on electrical resistance measurements using the Wiedemann–Franz law. There is little evidence of the validity of this law in the case of joints. Nevertheless, our results are in good agreement with the literature predictions, suggesting that such predictions are a reasonable approximation.
Keywords
Sub-Kelvin , Contact conductance , copper
Journal title
Cryogenics
Serial Year
2004
Journal title
Cryogenics
Record number
1172433
Link To Document