Ceramics grinding under the condition of constant pressure

To meet the increasing demand on the quality and cost of precision components for the semiconductor industries, extensive studies on high efficiency and precision machining of ceramic materials have been conducted over the past few years. It is found that the effects of grinding pressure and the rotational speed of the spindle in the machining of ceramic materials are very significant on the quality of the grinding process. In order to achieve stable grinding conditions for improved performance, a new grinding control scheme in which the grinding pressure is maintained constant throughout the grinding process was explored in the present study. Based on the experimental results, the microanalysis of the ground surfaces, and the comparison of the analytic and measured temperature profiles, the material removal mechanisms for constant pressure grinding were discussed.